S2000-T Tri-temp Prober
Specifications
DUT Type
Logic, MCU, SOC, DRAM, NAND, etc.
Wafer Size
200mm/300mm
Wafer Thickness
Standard: 200μm-1250μm
Test Site
Max. 2048 site
Index Time
240ms (X: 6mm, Z: 0.5mm)
Probing Force
450kg
Test Temperature
-40℃-150℃±1℃ (optional: -55℃)
MTBF
≥168h
Communication Interface
GPIB, RS-232
Optional Function
Low-noise chuck, APC, Auto-Leveling, Hinge, MES, OHT, etc.
