Defect Inspection Equipment
TR48MK5 AOI Taping Machine
Be used for inspecting the appearance defects of packaged devices
It utilizes STI’s patented 2D visual inspection system to inspect dimensions, appearance defects, marks,and more with OCR and 2DID functions. It is applicable to devices with packages like QFN, LGA, BGA, and QFP.
TR48MK5 AOI Taping Machine
Specifications
IC Package Type
QFN/QFP/TSSOP/BGA/LGA
IC Package Size
3mm×3mm～17mm×17mm (>17mm, the middle nozzle needs to be disabled)
Compatible Tray
Standard JEDEC tray; up to 30 trays can be stored
Carrier Tape Width
8mm, 12mm, 16mm, 24mm, 32mm, 44m
Operation Mode
Tray to Tray | Tray to Reel | Reel to Tray
PNP
Three nozzles
Vision
Inpocket, PostSeal
3D Camera
Optional
Review Lens (Color)
Yes
Transferring Manipulator
Precise dual-arm module
OCR/QR Code
Yes
Alarm Light
Three-layer LED (semiconductor long-life energy-saving type) light tower with red, yellow, and green lights)
UPH
Dummy run UPH ≥18,000 (based on QFN4×4 devices with 100% vision yield)
Jam Rate
≤1/8000
MTBA
≥1h
MTBF
≥168h
Device Overlapping Detection
Sensor
Interface
TTL, GPIB, RS232
Main Power Supply
AC 220V/32A, 50Hz
Dimensions
2300mm(L)×1300mm(W)×2000mm(H)