Bare Die Test Handler
iSort Intelligent Sorter
A die appearance inspection equipment intended for wafer-level assembly
It is a die appearance inspection equipment intended for wafer-level assembly. It inspects die dimensions, appearance defects, marks, OCR, and more. It is applicable to devices including strip CSP, wafer-level, bare chips, plastic devices and more.
iSort Intelligent Sorter
Specifications
IC Packaging
Strip CSP/wafer-level/bare chips/plastic devices
Loader
Stretched blue film
Unloader
Tape/tray
Silicon Wafer Size
6 in/8 in/12 in
Chip Size
0.5mm×0.5mm~10mm×10mm
UPH
20,000 at most
Carrier Tape Width
8mm~16mm
Inspection Site
Front | Back | In-tape | 5S (optional) | Post-tape (optional)
3D Bump Inspection
Optional
Inspected Item
Device size, scratches/foreign objects/lack of corners/cutting quality/mark/direction/indentation quality/indentation offset
OCR Inspection
Yes
2D Matrix
Yes
MTBA
1h
MTBF
1,000h
Rework Capability
Yes
Equipment Dimension
2.1m×1.6m×2m